Balluff at the interpack

Experience Balluff at interpack 2017. The leading global trade show for the packaging industry offers solutions and concepts for the entire value-added process. Visit Balluff in hall 6 at booth A74. And learn the latest about modern digital concepts to optimally network your production and automation systems. We cordially invite you. We offer you topic- and practice-oriented solutions: from the sensor to the control level. Our highlights: * Track-and-trace - our high-performance RFID for reliable tracing of all data * Safety over IO-Link - the first safety concept to combine IO-Link and safety in one system * safe communication across all levels - thanks to high-performance I/O modules and masters in stainless steel and the intelligent IO-Link communication standard * monitored format adjustment with the aid of high-precision displacement measuring systems * fast and reliable exchangeable part detection using industrial identification systems such as RFID or vision systems * modern asset management with Choc-ID software Ask us your questions. Our trade fair team will be happy to advise you!